[1]刘标,李先芬,柴旭东,等.激光锡球软钎焊工艺参数对微焊点形态及润湿性的影响[J].焊管,2024,47(6):22-27.[doi:10.19291/j.cnki.1001-3938.2024.06.004]
　LIU Biao,LI Xianfen,CHAI Xudong,et al.Effect of Laser Solder Ball Soft Brazing Process Parameters on the Morphology and Wettability of Micro Solder Joints[J].,2024,47(6):22-27.[doi:10.19291/j.cnki.1001-3938.2024.06.004]
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激光锡球软钎焊工艺参数对微焊点形态及润湿性的影响()
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《焊管》[ISSN:1001-3938/CN:61-1160/TE]

卷:
47
期数:
2024年第6期
页码:
22-27
栏目:
试验与研究
出版日期:
2024-06-27

文章信息/Info

Title:
Effect of Laser Solder Ball Soft Brazing Process Parameters on the Morphology and Wettability of Micro Solder Joints
文章编号:
10.19291/j.cnki.1001-3938.2024.06.004
作者:
刘标; 李先芬; 柴旭东; 蔡楷; 蒙永民; 华鹏; 徐政
合肥工业大学 材料科学与工程学院，合肥 230009
Author(s):
LIU Biao; LI Xianfen; CHAI Xudong; CAI Kai; MENG Yongmin; HUA Peng; XU Zheng
School of Materials Science and Engineering，Hefei University of Technology，Hefei 230009，China
关键词:
激光锡球焊; SAC305锡球; 激光功率; 加热时间; 焊点形态
Keywords:
laser solder ball soldering; SAC305 solder ball; laser power; heating time; solder joint morphology
分类号:
TG456.7
DOI:
10.19291/j.cnki.1001-3938.2024.06.004
文献标志码:
A
摘要:
为了探索激光锡球焊工艺参数对微焊点形貌的影响，采用激光锡球焊将直径 0.25 mm的SAC305 锡球在沉镍金焊盘上制备微焊点，并分析了微焊点的形貌及 SAC305/焊盘界面的润湿性。结果表明，激光功率27 W、加热时间8 ms 为最佳工艺参数，采用此工艺参数制备的微焊点均匀铺展在焊盘上，无缺陷；微焊点高度与激光功率、加热时间均呈负相关，微焊点铺展直径与激光功率、加热时间均呈正相关；SAC305/焊盘界面平整，喷出的SAC305锡球/镀Ni的Cu焊盘界面润湿性良好。
Abstract:
In order to explore the effect of laser solder ball soldering process parameters on the morphology of micro solder joints, laser solder ball soldering was used to prepare micro solder joints on electroless nickel/immersion goldpads with 0.25 mm diameter SAC305 solder balls, and the micro solder joint morphology and SAC305/pad interface wettability were analyzed. The results show that the laser power of 27 W and heating time of 8 ms are the best process parameters, and the micro solder joints prepared by this process parameters are evenly spread on the pads without defects. The height of micro solder joints is negatively correlated with laser power and heating time, and the spread diameter of micro solder joints is positively correlated with laser power and heating time. SAC305/pad interface is flat, and good wettability is at the interface of sprayed SAC305 solder balls/Ni plated Cu pads.

参考文献/References:


1、MU D K，MCDONALD S D，READ J，et al.Critical properties of Cu6Sn5 in electronic devices： Recent progress and a review ［J］.Current Opinion in Solid State & Materials Science，2015（20）：55-76
2、LAU C S，KHOR C Y，SOARES D，et al.Thermo?echanical challenges of reflowed lead-free solder joints in surface mount components：a review［J］.Soldering & Surface Mount Technology，2016，28（2）：41-62
3、FENG J，XU D E，TIAN Y，et al.SAC305 solder reflow： identification of melting and solidification using in-process resistance monitoring［J］.IEEE Transactions on Components，Packaging and Manufacturing Technology，2019，9（8）：1623-1631
4、HUANG Y J，ZHANG Y X，GAO X D，et al.Laser joining technology of polymer?etal hybrid structures - a review［J］. Journal of Manufacturing Processes，2022（79）：934-961
5、GILLNER A，HOLTKAMP J，HARTMANN C，et al.Laser applications in microtechnology［J］.Journal of Materials Process?ng Technology，2005，167（2-3）：494-498
6、RAHIM K，MIAN A. A review on laser processing in electronic and MEMS packaging［J］.Journal of Electronic Packaging， 2017，139：030801
7、SEMERAD E，MUSJEJOVSKY L，NiCPLICS J.Laser soldering of surface-mounted devices for high-reliability applications［J］. Journal of Materials Science，1993，28（18）：5065-5069
8、KORDAS K，PAP A E，TOTH G，et al.Laser soldering of flip-chips［J］.Optics and Lasers in Engineering，2006，44（2）：112-121
9、PAL M K，GERGELY G，HORVATH D K，et al.Microstructural investigations and mechanical properties of pure lead-free （Sn-3.0Ag-0.5Cu and Sn-4.0Ag-0.5Cu） solder alloy［J］.Metal?urgical & Materials Engineering，2018，24（1）：27-36
10、PAL M K，GERGELY G，HORVATH D K，et al.Characterization of the interface between ceramics reinforcement and lead-free solder matrix，surfaces and interfaces［J］.Surfaces and Interfaces，2020，20：100576
11、NISHIKAWA H，IWATA N.Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn-Ag-Cu solder on a Cu Pad ［J］.Journal of Materials Processing Technology，2015，215：6-11
12、LIU W，TIAN Y H，WANG C Q，et al.Formation of AuSnx IMCs in Sn3.5Ag0.75Cu micro-solder joints fabricated by laser and hot air reflow processes［J］.Journal of Materials Science：Materials in Electronics，2013，24（1）：217-223
13、JEROMEN A，HELD C，GOVEKAR E，et al.Modelling of droplet detachment in the laser droplet brazing process［J］. Journal of Materials Processing Technology，2014，214（4）： 737-749
14、LIMA M S F，RIVA R，DESTRO M G，et al.Characterization of a laser-soldered avionic component using lead?ree paste［J］. Optics and Laser Technology，2009，41（2）：159-164
15、李通，潘开林，李鹏，等.基于SAC305焊料的红外激光植球功率和时间对焊点形态的影响［J］.半导体技术，2023，48（3）：247-254
16、王宁，严红燕，李慧，等.金属陶瓷润湿性影响因素的研究进展［J］.特种铸造及有色合金，2019，39（12）：1315-1319
17、付瑜，韩绍华，薛丁琪.基于金属蒸汽和外加磁场的MIG电弧模拟［J］.兵器材料科学与工程，2021，44（4）：94-98
18、LIU W，WANG C H，TIAN Y H，et al.TEM observation of interfacial compounds of SnAgCu/ENIG solder bump after laser soldering and subsequent hot air reflows［J］.Materials Letters，2016，163（15）：254-257.

备注/Memo

备注/Memo:
收稿日期：2023-07-10
作者简介：刘标（1999—），男，硕士研究生，材料加工工程专业，主要从事 PCB 板的激光软钎焊工艺研究。
更新日期/Last Update: 2024-06-27