[1]王洪铎.盲孔法残余应力测试中的电阻应变片粘贴技术[J].焊管,2009,32(3):35-37.[doi:1001-3938(2009)03-0035-03]
 WANG Hong-duo,ZHOU Yong,SHI Kai,et al.Sticking Technology of Resistance Strain Gauge in Determining Test of Residual Stress by the Blind-hole Technique[J].,2009,32(3):35-37.[doi:1001-3938(2009)03-0035-03]
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盲孔法残余应力测试中的电阻应变片粘贴技术
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《焊管》[ISSN:1001-3938/CN:61-1160/TE]

卷:
32
期数:
2009年第3期
页码:
35-37
栏目:
应用与开发
出版日期:
2009-03-28

文章信息/Info

Title:
Sticking Technology of Resistance Strain Gauge in Determining Test of Residual Stress by the Blind-hole Technique
文章编号:
1001-3938(2009)03-0035-03
作者:
王洪铎
王洪铎,周 勇,石 凯,刘彦明
Author(s):
WANG Hong-duoZHOU YongSHI KaiLIU Yan-ming
(School of Materials Sciences and Engineering,Xi’an Shiyou University,Xi’an 710065,China )
关键词:
应力测定残余应力电阻应变片粘贴技术
Keywords:
stress testingresidua stressresistance strain gaugesticking technology
分类号:
TG113.25
DOI:
1001-3938(2009)03-0035-03
文献标志码:
B
摘要:
残余应力的盲孔测试方法是工程构件应力分析常用的数据获取手段之一,在盲孔法应力测试中,应变片的粘贴质量将直接影响测试结果的可靠性和准确性。以大直径厚壁X80级管线钢管盲孔法残余应力测试为例,按照测试的基本工步,对电阻应变片粘贴操作工艺进行了介绍,该粘贴技术除可用于残余应力的盲孔测试方法以外,对其他以电阻应变片为测试元件的应用场合也具有一定的指导和借鉴意义。
Abstract:
The method for measuring residual stress by the blind-hole technique is a common data obtaining methods in stress analysis of engineering members.The veracity and reliability of tests are directly affected by sticking technology of resistance strain gauge.In the item about measuring welding residual stress of large-diameter thick-walled X80 pipelines,this article summarizes the sticking technology of resistance strain gauges according to the fundamental testing procedues.The technique can not only be used in the test of residual stress by the blind-hole technique,but also put forward some suggestions for the other application fields of resistance strain gauges as test units.

参考文献/References:

[1]康鲁杰,杨继红.电阻应变片的选用[J].科技应用,2004,33(6):9-10.
[2]高晓丁,胥光申,王锦.电阻应变片贴装方位偏差对测量结果的影响[J].西安石油学院学报,2001,16(6):41-43.
[3]王彬,扬鹏,刘玉岩.电阻应变式传感器的贴片及焊接技术[J].衡器,2002,31(6):30-32.
[4]吴宗贷,陶宝祺. 应变电测原理及技术[M].北京:国防工业出版社,1982.

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备注/Memo

备注/Memo:
作者简介:王洪铎(1976-),男,西安石油大学在读研究生,主要研究方向为材料焊接及表面工程技术研究。
收稿日期:2008-09-17
更新日期/Last Update: